Gather around! PCB lamination sequence details to create an integrated circuit board manufacturing

The PCB lamination sequence is one of the key steps in the printed circuit board manufacturing process, and its purpose is to press multiple layers of circuit boards together to form an integrated board assembly.The PCB lamination sequence generally includes the following steps:

  1. Material Preparation: First of all, you need to prepare the materials used to make the circuit board, including circuit board substrate, copper foil, dry film, paint and so on.
  2. Board production: according to the design of the circuit board graphics, negative production and line production. Negative production is the transfer of circuit board graphics to the circuit board substrate, while the line production is the copper foil covered in the negative, through the exposure, development and other process steps to form a circuit board.
  3. Stacking and Positioning: The circuit board substrates are stacked and positioned according to the design requirements to ensure that the distance and position between the layers of the circuit board is accurate.
  4. Hot pressing: The stacked and positioned circuit boards are placed into the hot pressing machine and hot pressed under high temperature and high pressure conditions. The purpose of hot pressing is to bond the layers together to form an integrated circuit board assembly.
  5. Machining and Drilling: After hot pressing, the circuit boards need to be machined and drilled to form the desired shapes and connection holes.
  6. Surface treatment: The surface of the circuit board is treated to enhance its conductivity and reliability. Common surface treatments include gold plating, silver plating, and chemical nickel.
  7. Inspection and Testing: Final inspection and testing of the circuit board to ensure that it meets the design requirements and quality standards. Inspection and testing include appearance inspection, electrical performance testing, etc.

In short, the PCB lamination sequence is one of the key steps in the production of circuit boards, and its quality directly affects the quality and reliability of the circuit board. Therefore, it is necessary to strictly control the quality and process parameters of each step in the process of making boards to ensure that high-quality circuit board components are produced.

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