PCB Capability
| GENERAL PARAMETERS | ||||
|---|---|---|---|---|
| Manufacturing Materials | Capability | |||
| Material Brand | KB,TUC,EMC,MGC,ITEQ,SYTECH,Rogers,Arlon,Nanya,Isola,Nelco,Taconic,Panasonic,Ventec,Dupond,Taiflex,etc. | |||
FR4 | Tg135: KB6160, S1141, TU662 | |||
| Tg150: KB6165, S1000H, IT158 | ||||
| Tg170: KB6167, S1000-2M, IT180A, TU768 | ||||
Halogen Free FR4 | Tg150: S1150G | |||
| Tg170: S1170G, TU862HF | ||||
| High CTI(CTI≥600) | KB-6160C, S1600L, S1151G(Halogen Free) | |||
| Ceramic Filling High Frequency Material | Rogers 4003C/4350B, Arlon25N, S7136H, WL-CT350 | |||
| PTFE High Frequency Material | Rogers Series, Arlon Series, Taconic Series, F4BM Series, Teflon,etc. | |||
| High Speed Material | TU-872SLK/SLK-SP, TU883/933, Panasonic Megtron4/Megtron6/Megtron7, Isola FR408HR | |||
| Rigid PI Material | Arlon 85N, VT901 | |||
| Metal Base Board | Bergquist Al base, Chinese Brand Al base, Copper base | |||
| BT Materials For Chip-LED | CCL-HL820WDI， SY-WLM1 | |||
| BT Materials for IC Plastic Package | CCL-HL832NS, CCL-HL832NSR, CCL-HL832NSF, GHPL-830SR, CCL-HL972LFG, SI10US | |||
| Material Mixed Laminate | 4 layers – 48 layers (FR4 + High Frequency/Speed Material, FR4 + Metal Base, FR4 + FPC) | |||
Special PP | NFPP: Arlon 49N, VT47 | |||
| Ceramic Filling PP: Rogers 4450F | ||||
| PTFE PP: Arlon 6700, Taconic FR-27 | ||||
| BT PP:GHPL-830NS, GHPL-830NSR, GHPL-830SR, GHPL-970LFG | ||||
| Note | Other special materials can be processed and produced by means of customer supply or purchasing. | |||
| Item | Standard | Advanced | Innovative | |
| IC Space(Green Color) | 4 | 4 | 3 | |
| IC Space(Other Color) | 5 | 5 | 4 (blue oil) | |
| Liquid Photoimageable(LPI)Solder Mask Registration | 3mil | 2mil | 1.5mil | |
| Thickness T＞1.0 mm | ±10% | ±8% | ±5% | |
| Tolerance T≤1.0 mm | ±0.1 | ±0.1 | ±0.05 | |
| Board Thickness (mm) | 0.5-5.0 | 0.25-6.5 | 0.1-10 | |
| Hole Aspect Ratio | 10:1 | 12:1 | 20:1 | |
| Via Size For Plug Solder Mask | 0.25-0.5 | 0.20-0.5 | 0.15-0.6 | |
| Via Size For Plug Resin And Capped Copper | 0.25-0.5 | 0.20-0.5 | 0.075-0.6 | |
| Panel Size (mm) | 457×609 | 457×609 | 609×1200 | |
| Bow And Twist | ≤0.75% | ≤0.75% | ≤0.5% | |
| INNER GRAPHICS | ||||
| Item | Basic copper thickness | Line Width/Space | ||
Minimum Inner Line Width Distance | 1/3 OZ | 2/2 | ||
| 0.5 OZ | 2.5/2.5 | |||
| 1.0 OZ | 3/3 | |||
| 2.0 OZ | 5/5 | |||
| 3.0 OZ | 7/7 | |||
| 4.0 OZ | 9/9 | |||
| 5.0 OZ | 10/16 | |||
| 6.0 OZ | 10/10.5 | |||
| 10 OZ | 18/20 | |||
| 12 OZ | 22/24 | |||
Hole to Line Spacing | 4 layers | ≥3mil(1 core) | ||
| 6 layers | ≥5mil(2 core) | |||
| 8 layers | ≥7mil(3 core) | |||
| 10 layers and above | ≥7mil | |||
| Line Width/Space Accuracy | Non-impedance plate ±20%; Impedance plate ±10% | |||
| Alignment Accuracy | ±25um（CCD） | |||
| OUTER GRAPHICS | ||||
| Item | Basic copper thickness | Line Width/Space | ||
Minimum Outer Line (mil) | 1/3 OZ | 2.5/2.5 | ||
| 0.5 OZ | 2.8/2.8 | |||
| 1.0 OZ | 3/3 | |||
| 2.0 OZ | 5/5.5 | |||
| 3.0 OZ | 6/7.5 | |||
| 4.0 OZ | 14/12 | |||
| 5.0 OZ | 18/17 | |||
| 6.0 OZ | 13/11 | |||
| 10 OZ | 16/26 | |||
| 12 OZ | 24/32 | |||
The Minimum Line Width Of The Outer Etched Word | Base Copper H OZ; 8mil | |||
| Base Copper 1 OZ; 10mil | ||||
| Base Copper 2 OZ; 12mil | ||||
| Line Width/Space Accuracy | Non-impedance plate ±20%; Impedance plate ±10% | |||
| Alignment Accuracy | ≤24um（LDI） | |||
| HOLE PROCESSING | ||||
| Item | Mass Production | Prototyping | ||
Through Hole | Hole Diameter (max) | 6.5mm, thickness <6.4mm | Greater than 6.5mm (hole expansion process) | |
| Hole Diameter (min) | 0.15mm，thickness<1.0mm | 0.15mm, thickness<1.6mm | ||
| Hole Tolerance | NPTH±0.05mm, PTH hole±0.075mm, crimping hole±0.05mm | |||
| Hole Tolerance | ±0.05mm | |||
| Thickness Ratio | 8:1 | 20:1 | ||
| Minimum Hole Spacing | The same grid > 8mil Non-same grid ≥ 12mil | The same grid ≥ 6mil Non-same grid ≥ 10mil |
||
Deep Hole Control | Minimum Depth Control Hole Diameter | 0.155mm | ||
| Depth Control Accuracy | 0.1mm | 0.05mm | ||
| Hole Depth Thickness Diameter Ratio | ≤0.6:1 | ≤0.8:1 | ||
| Control Depth Groove Depth Tolerance | ±0.15mm | ±0.1mm | ||
Stepped Hole | Step Hole Diameter Tolerance | 0.1mm | 0.05mm | |
| Step Hole Depth Tolerance | 0.2mm | 0.1mm | ||
Laser Hole | Laser Hole Copper | ≥10um | ||
| Hole Diameter Range | 0.1mm-0.15mm | 0.076mm-0.15mm | ||
| Laser Blind Hole Thickness To Diameter Ratio | ≤0.6:1 | ≤0.8:1 | ||
| Outer Line Width And Line Spacing | 3.5/4mil | 3.5/3.5mil | ||
| Inner Line Width And Line Spacing | 3.0/3.5mil | 3.0/3.3mil | ||
| Laser Blind Hole Medium Thickness | 2.5-4mil | 2.5-5mil | ||
Back Drilling | Depth Tolerance | ±0.1mm | ||
| Position Tolerance | ±0.1mm | |||
| Hole To Outer Line Distance | ≥0.15mm | ≥0.125mm | ||
| Hole To Inner Line Distance | ≥0.175mm | ≥0.15mm | ||
Countersunk Hole | Countersunk Drill Diameter | The 45° countersunk bit has a diameter of 4.5mm | ||
| 60°, 82°, 90° countersunk bit diameter is 6.35mm | ||||
| 100° countersunk bit diameter is 6.5mm | ||||
| Outer Aperture Accuracy | ±0.2mm | |||
| PTH Countersunk Ring Width | 8mil | |||
| PTH Countersunk Hole Distance Line | 12mil | |||
Conical Hole | Opening Tolerance | ±0.2mm | ||
| Aperture Angle | 45°、60°、90° | |||
| Slot | Minimum Slot | 0.5mm | ||
| OUTLINE | ||||
| Item | Mass Production | Prototyping | ||
V-CUT | Angle | 20°、30°、45°、60° | ||
| Jumping Knife Distance | ≥8 mm | |||
| Board Thickness | 0.4 mm-3.0mm | |||
| Thickness Accuracy | ±0.1 mm | ±0.05 mm | ||
Gong Board | Minimum Gong Cutter Diameter | 0.6 mm | ||
| Control Deep Gong Plate Thickness | ≥0.4 mm | |||
| Depth Tolerance Of Deep Gong Plate | ±0.15 mm | ±0.1 mm | ||
| Tolerance Of Deep Gong Plate Size | ±0.13 mm | |||
Hypotenuse | The Outer Layer Of The Top Of The Gold Finger Is Copper | Bevel depth +0.2 mm | ||
| The Inner Layer Of The Top Of The Gold Finger Is Copper | Bevel depth +0.4 mm | |||
| Angle (tolerance ±5°) | 20°, 30°, 45°, hypotenuse angle is usually 30° | |||
| SURFACE TREATMENT | ||||
| Item | Standard | Advanced | Innovative | |
ENIG | Nickel Thickness (um) | 2.0-5.0 | 3.0-5.0 | 3.8-7.62 |
| Gold Thickness(uinch) | 1.0-2.0 | 2.0-3.0 | 3.0-5.0 | |
Hard Gold (Au Thickness) | Normal Golden Finger（um） | 0.15 | 0.8 | 3.0 |
| Selective Hard Gold (um) | 0.15 | 0.8 | 2.0 | |
ENEPIG | Nickel Thickness (um) | 2.0-5.0 | ||
| Palladium Thickness(uinch) | 4.0-20.0 | |||
| Gold Thickness(uinch) | 1.0-5.0 | |||
Plating Gold | Nickel Thickness (um) | 2.0-7.62 | ||
| Gold Thickness(uinch) | 1.0-5.0 | |||
| Immersion Tin | Tin Thickness (um) | 0.8-1.2 | ||
| Immersion Silver | Sliver Thickness (um) | 0.15-0.4 | ||
| OSP (um) | 0.2-0.6 | |||
| Tin Lead HASL (um) | 2.0-40.0 | |||
| Lead Free HASL (um) | 2.0-40.0 | |||
| Note：Tin Lead /LF HASL panel size should less than ≤500×600 mm，thickness≥0.6 mm；Hard Gold panel size≤400×500 mm，the other surface treatment panel size less than 500×900 mm | ||||
| SPECIAL PROCESS | ||||
| Item | Standard | Advanced | Innovative | |
| Back Drilling | YES | YES | YES | |
| Heavy Copper PCB with Blind/Burried Via | YES | YES | YES | |
| N + N Structure | YES | YES | YES | |
| POFV(VIPPO) | YES | YES | YES | |
| Long-Short Gold Finger | YES | YES | YES | |
| Buried Capacitance/Resistance | YES | YES | YES | |
| Plated Half Holes/Edge Plating | YES | YES | YES | |
| Soft Bondable Gold | YES | YES | YES | |
| Embedded Daughter Board | YES | YES | YES | |
| Embedded Magnetic Cores | YES | YES | YES | |
| PTH/NPTH Step Slots | YES | YES | YES | |
| Step Gold Finger | YES | YES | YES | |
| Graph In Bottom Of Step | YES | YES | YES | |
| Post Bonding | YES | YES | YES | |
| Sweat Soldering | YES | YES | YES | |
| Embedded Coin/Ceramic | YES | YES | YES | |
| High Depth Laser Hole | YES | YES | YES | |
| Double Side Press Fit Hole | YES | YES | YES | |
| Hybrid Material Lamination(Local Hybrid) | YES | YES | YES | |
| DELIVERY ABILITY | ||||
| 1-2L Lead-time | Sample Expedited 8 hours, Normal 2-3 days, Mass production 5-7days | |||
| 4-8L Lead-time | Sample Expedited 24 hours , Normal 5-7days, Mass production 7-10 days | |||
| 10-18L Lead-time | Sample Expedited 48-72 hours, Normal 10-15 days,Special circumstances based on the actual PCB design | |||
| More than 20L Lead-time | Normal 10-15 days ,Special circumstances based on the actual PCB design | |||
| Acceptable File Format | ALL Gerber Files、POWERPCB、PROTEL、PADS2000、CAD、AUTOCAD、ORCAD、P-CAD、CAM-350、CAM2000 etc. | |||
Who is PEAK?
Founded in 2007, PEAK Co.,Ltd is an electronic solutions company offering 1-64 layers PCB fabrication, assembly, testing & validation of rigid, rigid-flex, HDI, high frequency, high speed, metal core, IC substrate, substrate-like and other special PCB. Our modern 54,000 square foot manufacturing facility allows us to provide all rigid & rigid-flex services under one roof and offer quick-turn capabilities.PEAK has a professional reputation for developing high-performance solutions for technically advanced OEM’s in a variety of markets including aerospace and defense, medical, computer, communication, server, semiconductor IC, automotives, industrial control, optoelectronics, LED and others.
Ability to Handle Complex Jobs
All Rigid & Rigid-Flex Services Under One Roof
Regular PCB
Up to 64 Layers; FR4 TG135/TG150/TG170; Halogen Free/CTI≥600; Aspect Ratio (Finish Hole) 28:1; Sample Expedited 8 Hours(1-2Layer);
Metal Core PCB
Thermal Conductivity 1-398W/m.K; Aluminum/Copper AC 500-4000V; Post-bonding/Pre-bonding; Sweat-Soldering/Conductive Adhesive; Press-Fit/Embedded Coin(I, T U);
HDI PCB
Blind/Buried/Hybrid Via; 5+N(N+M)+5 Structure; Trace Width/Spacing 1.6/1.6mil; Laser Hole Size(mm)≥0.075; High Density Interconnector;
Rigid-Flex PCB
2-24 Layers; Book/Air-gap/Fly-tail; Unsymmetrical/Semi-Flex; Width of Flexible Zone 3mm(min); Dimension Accuracy ±0.05mm(min);
High Frequency PCB
More than 85+ Types; Rogers/Arlon/Taconic/Isola/ Nelco/F4B Serices,etc; Materials can be Specified; Impedance Tolerance ±5%(min);
Substrate PCB
CSP/FC-CSP/SIP/FC-BGA/WB-CSP; FR4/BT/High-Speed Material; Trace Width/Space 12/12μm; SM Registration:±20μm; Strict SM Flatness Control ≤5μm;
High Speed PCB
Panasonic Megtron4/6/7; TU-872SLK/Isola-FR408HR,etc; Impedance Tolerance ±5%(min); Dimension Accuracy ±0.02mm(min); Line Width/Space Accuracy ±5%;
Specialty PCB
Ceramic/Glass Material; Hybrid Material Lamination; Buried Capacitance/Resistance; PTH/NPTH Step Slots; Uneven/Segmented/Step Gold Finger;
Check it out
High Frequency PCB
ITEQ IT150DA (DK3.56; DF0.0047) Double Side Immersion Gold 1u PCB
Halogen Free PCB
Standard 4 Layers Halogen Free Immersion Gold 1u EMC-EM280H PCB
