The future direction of PCB technology

Throughout the current international development of electronic circuits and trends, about China’s electronic circuits – printed circuit board industry technology and policy, to enhance the electronic circuit technology is imperative.

First, chip-scale packaging CSP will gradually replace the TSOP, ordinary BGA

CSP is a chip-scale packaging, it is not a separate form of packaging, but the chip area and packaging area can be compared to the chip-level packaging, CS P package can make the chip area and packaging area ratio of more than 1:1.14, has been quite close to the ideal situation of 1:1, about 1/3 of the ordinary BGA; C SP package chip center pin form effectively shorten the signal conduction distance C SP package chip center pin form effectively shorten the signal conduction distance, its attenuation is reduced, the chip’s anti-interference, anti-noise performance can be greatly improved, in the CSP package, the chip particles are soldered to the PCB board through a tin ball, due to the solder joints and the PCB board has a larger contact area, so the chip in the operation of the heat generated by the PCB board can be easily conducted and emitted out.

Development prospects: should be light, thin, short, small electronic products and the development of chip-level packaging is a new generation of packaging, in accordance with the development trend of electronic products, chip-level packaging will continue to develop rapidly and gradually replace the TSOP (ThinSmallOutlinePackage) package as well as ordinary BGA package.

Second, by 2010, the output value of photoelectric panels increased by 14% per year

Photoelectric board that is, photoelectric backplane, is a built-in light path of special printed circuit boards, backplane is also a kind of backplane, mainly used in the field of communications. The main advantages of the photoelectric backplane: low signal distortion; to avoid noise; very low crosstalk; loss is independent of frequency; dense wavelength multiplexing technology; 12-6 channel multiplexing connector; waveguide multi-channel connector; to improve the reliability of discrete cables; photoelectric board layers up to 20 layers, lines more than 20,000, connectors 1,000 pins; the traditional backplane due to the use of copper conductors, it is subject to bandwidth Certain limitations.

Development prospects: due to the growth of bandwidth and distance, copper material transmission line will reach the limit of bandwidth and distance, and photoelectric transmission can meet the needs of bandwidth and distance increase. Optical backplanes are mainly used in communication exchange and data exchange, and future development will be applied to workstations and servers. According to forecasts, by 2010 the global output value of the photoelectric backplane will reach 200 million U.S. dollars, an annual growth of about 14%.

Third, just flexible combined board development prospects are very favorable

Flexible board FPC called very messy in the past, the earliest known as flexible board, later called flexible board, flexible printed circuit boards and so on. Rigid-flex combination of printed circuit boards is a printed circuit board contains one or more rigid areas and one or more flexible areas, composed of rigid and flexible boards orderly laminated together, and metalized holes to form electrical connections. Rigid-flex printed circuit boards can provide both rigid printed circuit boards due to the role of support, but also flexible board bending, to meet the requirements of three-dimensional assembly, in recent years, the demand is growing. The traditional rigid-flexible board design idea is to save space, easy to assemble and improve reliability; integrated traditional rigid-flexible board design and micro-blind hole technology of the new rigid-flexible board for the interconnection field provides a new solution. Its advantages include: suitable for folding mechanism, such as flip phone, camera, laptop; improve the reliability of the product; apply the traditional assembly method, but can make the assembly simplified and suitable for 3D assembly; combined with micro-guide hole technology, it provides better design convenience and use smaller components; use lighter material instead of the traditional FR-4. rigid-flex boards used in cell phones are generally two-layer flexible boards connected with a rigid board. The rigid-flexible board for cell phones is generally a two-layer flexible board connected to a rigid board.

Development prospects: rigid-flexible board is a very rapid growth in recent years, a class of PCB, which is widely used in computers, aerospace, military electronics, cell phones, digital (camera) camera, communications equipment, analytical instruments, etc.. It is predicted that the average annual growth rate in 2005-2010 is more than 20% by value, and the average annual growth rate by area is more than 37%, which is much faster than the growth rate of ordinary PCB. So far, the ability to produce just flexible board manufacturers are very few, almost no manufacturers have experience in mass production, so its development prospects are very favorable.

Fourth, the high multilayer boards to the Chinese industry to bring opportunities

Multilayer board refers to independent wiring layer is greater than two layers of PCB boards, generally by a number of double-sided boards stacked in a laminated manner, each layer of the board through a layer of insulation compression synthesized into a whole board. High multilayer board generally refers to the number of layers greater than 10 layers of multilayer boards, mainly used in switches, routers, servers and mainframe computers, some supercomputers used more than 40 layers.

Development prospects: ordinary multilayer boards are mature products, the future growth is relatively stable; but high multilayer boards with high technology content, coupled with Europe and the United States and other countries basically give up the conventional level of PCB production, to the Chinese industry to bring some opportunities. Predicted future high multilayer board (backplane) annual growth of about 13%.

Fifth, 3G board to improve the technical level of PCB products

Adaptation of the third generation of mobile communication products (3G) of the printed circuit board. 3G board generally refers to the 3G cell phone board, which is a high-end printed circuit boards, the use of advanced 2 times the laminated process manufacturing, line level of 3 mil (75 μm), the technology involved in plating to fill in the holes, stacked holes, just a series of printed circuit boards, such as a series of cutting-edge technology, flexure. 3G technology than the existing products have significantly improved.

Development prospects: 3G is the next generation of mobile communications technology, Europe, the United States, Japan and other developed countries have begun to apply, 3G will eventually replace the existing 2G and 2.5G communications, as of the end of 2005, the number of global 3G users grew 57.4%, the total number of 237 million, in 2005, a total of 122 million sales of various types of 3G cell phones, the future of the development of the future is still to maintain a growth rate of more than 20%. The future development will still maintain a growth rate of more than 20%. With the supporting printed circuit boards, that is, 3G board to maintain the same growth rate. 3G board is an upgrade of existing products, it makes the overall level of the PCB industry into a higher level.

Six, HDI board rapid growth in the future

HDI is the abbreviation of High Density Interconnect, is the production of a printed circuit board (technology), is now widely used in cell phones, digital (camera) like machine, MP3, MP4, etc., generally using the method of accumulation of layers (Build-up) manufacturing, the more the number of times of accumulation of layers, the higher the technical grade of the board. Ordinary HDI board is basically 1 time layer, high-level HDI using 2 or more times the layer technology, while using stacked holes, plating to fill the holes, laser direct hole punching and other advanced PCB technology. High-order HDI boards are mainly used in 3G cell phones, advanced digital video cameras, IC carrier boards and so on.

Development prospects: According to the use of high-level HDI boards – 3G board or IC carrier board, its future growth is very rapid: the next few years the world’s 3G cell phone growth will be more than 30%, China is about to issue a 3G license; IC carrier industry consulting organization Prismark predicted that China’s forecast growth rate of 80% from 2005 to 2010, which represents the direction of the technological development of PCBs.

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