PCB lamination common problems: how to find and solve the problem

Press-fit is an important step in the PCB (printed circuit board) fabrication process. However, there are a number of problems that can be encountered during this process, including delamination, indentation, bubbles, and more. This article will detail these problems and how to spot and solve them.

Problem 1: Delamination

Delamination is one of the most common problems in the PCB lamination process. It usually occurs between different materials, such as copper and insulation layers. The presence of delamination may lead to degradation of the electrical performance of the board or even lead to board failure.

Detection method: Delamination can be detected by visual inspection and X-ray inspection. In visual inspection, you can observe whether there are any abnormalities on the board surface, such as blistering, color changes, etc. In X-ray inspection, you can see through the board to the internal structure and thus detect delamination.

Solution: The key to avoiding delamination lies in choosing the right materials and processes. First, make sure that the materials used have good compatibility. Second, some pretreatment methods, such as surface treatment and coating, can be used to enhance the adhesion between materials. In addition, optimizing the parameters of the lamination process, such as temperature, pressure, time, etc., is also an effective means to prevent delamination.

Issue 2: Indentation

Indentation refers to the phenomenon of localized depressions or bumps on the circuit board due to uneven pressure or pressure from foreign objects during the lamination process. Indentation may lead to a decrease in the flatness of the circuit board, affecting subsequent processing and installation.

Discovery method: Indentation can be detected by visual inspection. Observe whether there are uneven undulations on the surface of the circuit board and whether there is any foreign matter left.

Solution: First, ensure that the lamination material used has the proper thickness and flatness. Second, make sure that the pressure is evenly distributed to avoid compression by foreign objects. During the pressing process, roller or flatbed presses can be used to apply uniform pressure. If indentation occurs, the circuit board can be leveled at the appropriate time, such as using thermal leveling process.

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