PCB Fabrication
                Drilling Machine
                Inner Layer Etching
                AOI Scanning
                CNC
                Cold and Heat Shock
                Impedance Tester
                Clean Room
                Copper Sinking Line
                Auto-Development
                Graphic Plating
                Flying Probe Tester
                Copper Foil Tensile
                Hole Copper Tester
                Laboratory
                Palm Fiber Line
                Automatic Laminator
                Screen Printing
                Water Washing
                Strong Peel Tester
                Hundredfold Loupe
                Silkscreen Workshop
                Plate Grinding
                Exposure Machine
                Press Board Furnace
                Vacuum Packaging
                Halogen Tester
                Slicing Analysis
                Test Workshop
PCB Assembly
                Assembly 1
                AOI Optical Detector
                Drop Test
                X-Ray
                Assembly 2
                Assembly Welding
                Vibration Testing
                Wave Soldering 1
                Assembly 3
                DIP Line
                Patch Welding
                Wave Soldering 2
                Assembly 4
                High Temperature Box
                Silk Printer
                Workshop Corridor
Who is PEAK?
Founded in 2007, PEAK Co.,Ltd is an electronic solutions company offering 1-64 layers PCB fabrication, assembly, testing & validation of rigid, rigid-flex, HDI, high frequency, high speed, metal core, IC substrate, substrate-like and other special PCB. Our modern 54,000 square foot manufacturing facility allows us to provide all rigid & rigid-flex services under one roof and offer quick-turn capabilities.PEAK has a professional reputation for developing high-performance solutions for technically advanced OEM’s in a variety of markets including aerospace and defense, medical, computer, communication, server, semiconductor IC, automotives, industrial control, optoelectronics, LED and others.
															
															Ability to Handle Complex Jobs
All Rigid & Rigid-Flex Services Under One Roof

Regular PCB
Up to 64 Layers; FR4 TG135/TG150/TG170; Halogen Free/CTI≥600; Aspect Ratio (Finish Hole) 28:1; Sample Expedited 8 Hours(1-2Layer);

Metal Core PCB
Thermal Conductivity 1-398W/m.K; Aluminum/Copper AC 500-4000V; Post-bonding/Pre-bonding; Sweat-Soldering/Conductive Adhesive; Press-Fit/Embedded Coin(I, T U);

HDI PCB
Blind/Buried/Hybrid Via; 5+N(N+M)+5 Structure; Trace Width/Spacing 1.6/1.6mil; Laser Hole Size(mm)≥0.075; High Density Interconnector;

Rigid-Flex PCB
2-24 Layers; Book/Air-gap/Fly-tail; Unsymmetrical/Semi-Flex; Width of Flexible Zone 3mm(min); Dimension Accuracy ±0.05mm(min);

High Frequency PCB
More than 85+ Types; Rogers/Arlon/Taconic/Isola/ Nelco/F4B Serices,etc; Materials can be Specified; Impedance Tolerance ±5%(min);

Substrate PCB
CSP/FC-CSP/SIP/FC-BGA/WB-CSP; FR4/BT/High-Speed Material; Trace Width/Space 12/12μm; SM Registration:±20μm; Strict SM Flatness Control ≤5μm;

High Speed PCB
Panasonic Megtron4/6/7; TU-872SLK/Isola-FR408HR,etc; Impedance Tolerance ±5%(min); Dimension Accuracy ±0.02mm(min); Line Width/Space Accuracy ±5%;

Specialty PCB
Ceramic/Glass Material; Hybrid Material Lamination; Buried Capacitance/Resistance; PTH/NPTH Step Slots; Uneven/Segmented/Step Gold Finger;
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